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1

High-throughput determination of the antigen specificities of T cell receptors in single cells

Zhang, Shu-Qi, Ma, Ke-Yue, Schonnesen, Alexandra A, Zhang, Mingliang, He, Chenfeng, Sun, Eric, Williams, Chad M, Jia, Weiping, Jiang, Ning

Journal:

Nature Biotechnology

Year:

2018

Language:

english

File:

PDF, 3.80 MB

english, 2018

2

Real-Time Parking Occupancy Detection for Gas Stations Based on Haar-AdaBoosting and CNN

Xiang, Xuezhi, Lv, Ning, Zhai, Mingliang, El Saddik, Abdulmotaleb

Journal:

IEEE Sensors Journal

Year:

2017

Language:

english

File:

PDF, 1.88 MB

english, 2017

3

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Drop failure modes of a wafer-level chip-scale packaging

Huang, Mingliang, Liu, Shuang, Zhao, Ning, Long, Haohui, Li, Jianhui, Hong, Weiqiang

Year:

2013

Language:

english

File:

PDF, 1.50 MB

english, 2013

4

A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn–58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 3.01 MB

english, 2017

5

Optical flow estimation using channel attention mechanism and dilated convolutional neural networks

Zhai, Mingliang, Xiang, Xuezhi, Zhang, Rongfang, Lv, Ning, Saddik, Abdulmotaleb El

Journal:

Year:

2019

Language:

english

File:

PDF, 2.86 MB

english, 2019

6

Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Ma, Haitao

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 2.75 MB

english, 2018

7

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder

Liu, Xiaoying, Huang, Mingliang, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.03 MB

english, 2012

8

In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process

Qu, Lin, Zhao, Ning, Ma, Haitao, Zhao, Huijing, Huang, Mingliang

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 2.14 MB

english, 2015

9

Corrigendum to “On the increase of intermetallic compound’s thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215]

Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang

Journal:

Materials Letters

Year:

2018

Language:

english

File:

PDF, 210 KB

english, 2018

10

Liquid-state and solid-state interfacial reactions between Sn–Ag–Cu–Fe composite solders and Cu substrate

Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 1.83 MB

english, 2014

11

Field-driven evolution of chiral spin textures in a thin helimagnet nanodisk

Du, Haifeng, Ning, Wei, Tian, Mingliang, Zhang, Yuheng

Journal:

Physical Review B

Year:

2013

Language:

english

File:

PDF, 2.50 MB

english, 2013

12

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study on short time interfacial reactions between Sn-3.0Ag-0.5Cu solder balls and ENEPIG pads

Yang, Fan, Huang, Mingliang, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.58 MB

english, 2012

13

Design and Analysis of a Novel Converter Topology for Photovoltaic Pumps Based on Switched Reluctance Motor

Zan, Xiaoshu, Wu, Ning, Xu, Ruidong, Cui, Mingliang, Jiang, Zhikai, Ni, Kai, Alkahtani, Mohammed

Journal:

Year:

2019

File:

PDF, 6.24 MB

2019

14

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow

Wang, Xiaohui, Huang, Mingliang, Yang, Fan, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.17 MB

english, 2012

15

Formation mechanism and kinetic analysis of the morphology of Cu6Sn5in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage

Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 1.23 MB

english, 2017

16

Lifespan extension by n-butanol extract from seed of Platycladus orientalis in Caenorhabditis elegans

Liu, Haibin, Liang, Fengyin, Su, Weiwei, Wang, Ning, Lv, Mingliang, Li, Peibo, Pei, Zhong, Zhang, Yan, Xie, Xiang-Qun, Wang, Lirong, Wang, Yonggang

Journal:

Journal of Ethnopharmacology

Year:

2013

Language:

english

File:

PDF, 683 KB

english, 2013

17

Superconductor–Insulator Transition in Quasi-One-Dimensional Single-Crystal Nb 2 PdS 5 Nanowires

Ning, Wei, Yu, Hongyan, Liu, Yequn, Han, Yuyan, Wang, Ning, Yang, Jiyong, Du, Haifeng, Zhang, Changjin, Mao, Zhiqiang, Liu, Ying, Tian, Mingliang, Zhang, Yuheng

Journal:

Year:

2015

Language:

english

File:

PDF, 1.82 MB

english, 2015

18

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration

Zhong, Yi, Huang, Mingliang, Deng, Jianfeng, Ma, Haitao, Dong, Wei, Zhao, Ning

Year:

2016

Language:

english

File:

PDF, 595 KB

english, 2016

19

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder

Kang, Ning, Huang, Mingliang, Zhou, Qiang, Ma, Haitao

Year:

2011

Language:

english

File:

PDF, 2.75 MB

english, 2011

20

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Effects of stirring speed on composition and morphology of non-cyanide co-electroplating Au-Sn thin films

Liu, Yawei, Huang, Mingliang, Huang, Feifei, Zhao, Ning

Year:

2015

Language:

english

File:

PDF, 858 KB

english, 2015

21

Interfacial reaction mechanism of SiC joints joined by pure nickel foil

Shi, Haojiang, Chai, Yidi, Li, Ning, Yan, Jiazhen, Zhu, Xin, Chen, Kangwei, Bai, Dong, Liu, Zihao, Wu, Miaomiao, Zhang, Ruiqian, Li, Ming, Luo, Mingliang, Sun, Qi, Xin, Chenglai, Hu, Wenmin, Dong, Xin

Journal:

Journal of the European Ceramic Society

Year:

2020

File:

PDF, 4.94 MB

2020

22

One-dimensional weak antilocalization in single-crystal Bi2Te3 nanowires

Ning, Wei, Du, Haifeng, Kong, Fengyu, Yang, Jiyong, Han, Yuyan, Tian, Mingliang, Zhang, Yuheng

Journal:

Scientific Reports

Year:

2013

Language:

english

File:

PDF, 876 KB

english, 2013

23

Migration behavior of indium atoms in Cu/Sn–52In/Cu interconnects during electromigration

Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Yang, Fan

Journal:

Journal of Materials Research

Year:

2015

Language:

english

File:

PDF, 709 KB

english, 2015

24

ProbIDtree: An automated software program capable of identifying multiple peptides from a single collision-induced dissociation spectrum collected by a tandem mass spectrometer

Ning Zhang, Xiao-jun Li, Mingliang Ye, Sheng Pan, Benno Schwikowski, Ruedi Aebersold

Journal:

Year:

2005

Language:

english

File:

PDF, 381 KB

english, 2005

25

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of cooling rate and solder volume on the formation of large Ag3Sn plates in Sn-Ag based solder joints

Zhou, Qiang, Huang, Mingliang, Zhao, Ning, Zhang, Zhijie

Year:

2012

Language:

english

File:

PDF, 735 KB

english, 2012

26

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Reverse polarity effect in Cu/Sn-9Zn/Ni interconnect under high current density at high temperature

Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Feng, Xiaofei

Year:

2014

Language:

english

File:

PDF, 811 KB

english, 2014

27

nanosheets

Lu, Jianwei, Zheng, Guolin, Zhu, Xiangde, Ning, Wei, Zhang, Hongwei, Yang, Jiyong, Du, Haifeng, Yang, Kun, Lu, Haizhou, Zhang, Yuheng, Tian, Mingliang

Journal:

Physical Review B

Year:

2017

Language:

english

File:

PDF, 578 KB

english, 2017

28

Design and Analysis of a Novel Converter Topology for Photovoltaic Pumps Based on Switched Reluctance Motor

Zan, Xiaoshu, Wu, Ning, Xu, Ruidong, Cui, Mingliang, Jiang, Zhikai, Ni, Kai, Alkahtani, Mohammed

Journal:

Year:

2019

Language:

english

File:

PDF, 6.24 MB

english, 2019

29

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient

Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao

Year:

2015

Language:

english

File:

PDF, 1.01 MB

english, 2015

30

Photophysical and electrical properties of organic waveguide nanorods of perylene-3,4,9,10-tetracarboxylic dianhydride

Han, Yuyan, Ning, Wei, Cao, Liang, Xu, Xiaotao, Li, Tian, Zhang, Fapei, Pi, Li, Xu, Faqiang, Tian, Mingliang

Journal:

Year:

2016

Language:

english

File:

PDF, 1.81 MB

english, 2016

31

Size effect on the magnetic phase in Sr 4 Ru 3 O 10

Liu, Yan, Yang, Jiyong, Wang, Weike, Du, Haifeng, Ning, Wei, Ling, Langsheng, Tong, Wei, Qu, Zhe, Yang, Zhaorong, Tian, Mingliang, Cao, Gang, Zhang, Yuheng

Journal:

New Journal of Physics

Year:

2016

Language:

english

File:

PDF, 1.42 MB

english, 2016

32

de Haas–van Alphen study on three-dimensional topological semimetal pyrite PtBi2

Gao, Wenshuai, Zhu, Xiangde, Hu, Jin, Li, Shujing, Zheng, Fawei, Zhang, Hongwei, Wu, Min, Zheng, Guolin, Hao, Ning, Zhang, Ping, Ning, Wei, Tian, Mingliang

Journal:

Science Bulletin

Year:

2019

Language:

english

File:

PDF, 429 KB

english, 2019

33

Cross-Modality Person Re-identification Based on Dual-Path Multi-Branch Network

Xiang, Xuezhi, Lv, Ning, Yu, Zeting, Zhai, Mingliang, El Saddik, Abdulmotaleb

Journal:

IEEE Sensors Journal

Year:

2019

Language:

english

File:

PDF, 2.44 MB

english, 2019

34

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Dissolution of substrates in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects under current stressing

Pan, Song, Huang, Mingliang, Zhao, Ning, Zhou, Shaoming, Zhang, Zhijie

Year:

2012

Language:

english

File:

PDF, 1.54 MB

english, 2012

35

In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid interfacial reaction

Qu, Lin, Zhao, Ning, Ma, Haitao, Zhao, Huijing, Huang, Mingliang

Journal:

Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 1.23 MB

english, 2014

36

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint

Zhong, Yi, Huang, Mingliang, Ma, Haitao, Zhao, Ning

Year:

2015

Language:

english

File:

PDF, 816 KB

english, 2015

37

nanoplates

Zheng, Guolin, Wu, Min, Zhang, Hongwei, Chu, Weiwei, Gao, Wenshuai, Lu, Jianwei, Han, Yuyan, Yang, Jiyong, Du, Haifeng, Ning, Wei, Zhang, Yuheng, Tian, Mingliang

Journal:

Physical Review B

Year:

2017

Language:

english

File:

PDF, 745 KB

english, 2017

38

Electrical and anisotropic magnetic properties in layered Mn 1/3 TaS 2 crystals

Zhang, Hongwei, Wei, Wensen, Zheng, Guolin, Lu, Jianwei, Wu, Min, Zhu, Xiangde, Tang, Jin, Ning, Wei, Han, Yuyan, Ling, Langsheng, Yang, Jiyong, Gao, Wenshuai, Qin, Yongliang, Tian, Mingliang

Journal:

Applied Physics Letters

Year:

2018

Language:

english

File:

PDF, 1.22 MB

english, 2018

39

Signature of Dirac semimetal states in gray arsenic studied by de Haasâvan Alphen and Shubnikovâde Haas quantum oscillations

An, Linlin, Zhu, Xiangde, Qian, Yuting, Xi, Chuanying, Ning, Wei, Weng, Hongming, Tian, Mingliang

Journal:

Physical Review B

Year:

2020

File:

PDF, 2.09 MB

2020

40

Dual evidence of surface Dirac states in thin cylindrical topological insulator Bi2Te3 nanowires

Tian, Mingliang, Ning, Wei, Qu, Zhe, Du, Haifeng, Wang, Jian, Zhang, Yuheng

Journal:

Scientific Reports

Year:

2013

Language:

english

File:

PDF, 1.15 MB

english, 2013

41

Thickness dependence of the charge-density-wave transition temperature in VSe2

Yang, Jiyong, Wang, Weike, Liu, Yan, Du, Haifeng, Ning, Wei, Zheng, Guolin, Jin, Chiming, Han, Yuyan, Wang, Ning, Yang, Zhaorong, Tian, Mingliang, Zhang, Yuheng

Journal:

Applied Physics Letters

Year:

2014

Language:

english

File:

PDF, 962 KB

english, 2014

42

Evidence of Topological Two-Dimensional Metallic Surface States in Thin Bismuth Nanoribbons

Ning, Wei, Kong, Fengyu, Xi, Chuanying, Graf, David, Du, Haifeng, Han, Yuyan, Yang, Jiyong, Yang, Kun, Tian, Mingliang, Zhang, Yuheng

Journal:

Year:

2014

Language:

english

File:

PDF, 1.78 MB

english, 2014

43

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Interfacial reactions between Cu single crystals and lead-free solders during solid-state aging

Liu, Ting, Huang, Mingliang, Zhao, Ning

Year:

2012

Language:

english

File:

PDF, 1.88 MB

english, 2012

44

Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage

Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 3.23 MB

english, 2017

45

The promotion of neurite sprouting and outgrowth of mouse hippocampal cells in culture by graphene substrates

Ning Li, Xuemin Zhang, Qin Song, Ruigong Su, Qi Zhang, Tao Kong, Liwei Liu, Gang Jin, Mingliang Tang, Guosheng Cheng

Journal:

Year:

2011

Language:

english

File:

PDF, 1.80 MB

english, 2011

46

On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang

Journal:

Materials Letters

Year:

2016

Language:

english

File:

PDF, 1.33 MB

english, 2016

47

Modified Si nanowire/graphite-like carbon nitride core-shell photoanodes for solar water splitting

Ning, Minghui, Chen, Zhen, Li, Lin, Meng, Qingguo, Chen, Zhihong, Zhang, Yongguang, Jin, Mingliang, Zhang, Zhang, Yuan, Mingzhe, Wang, Xin, Zhou, Guofu

Journal:

Electrochemistry Communications

Year:

2017

Language:

english

File:

PDF, 1.15 MB

english, 2017

48

Contactless Microwave Detection of Shubnikov–De Haas Oscillations in Three-Dimensional Dirac Semimetal ZrTe 5

Wu, Min, Zhang, Hongwei, Zhu, Xiangde, Lu, Jianwei, Zheng, Guolin, Gao, Wenshuai, Han, Yuyan, Zhou, Jianhui, Ning, Wei, Tian, Mingliang

Journal:

Chinese Physics Letters

Year:

2019

Language:

english

File:

PDF, 1.07 MB

english, 2019

49

SEEKING LOST MEMORIES: APPLICATION OF A NEW VISUAL METHODOLOGY FOR HERITAGE PROTECTION

Wang, Min, Zhao, Meiting, Lin, Mingliang, Cao, Wei, Zhu, Huilin, An, Ning

Journal:

Geographical Review

Year:

2020

Language:

english

File:

PDF, 1.19 MB

english, 2020

50

Eco-Friendly and One-Step Modification of Poly(vinylidene fluoride) Membrane with Underwater Superoleophobicity for Effective Emulsion Separation

Zhu, Tang, Jiang, Chi, Wu, Junjie, Wang, Mingliang, Zhu, Caizhen, Zhao, Ning, Xu, Jian

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Year:

2020

File:

PDF, 3.24 MB

2020

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